CHIPS for America Archives - Government Market News

$1.4 billion awarded for domestic semiconductor packaging research, development

The federal funding is part of the CHIPS for America agenda and looks to establish domestic capacity for advanced semiconductor packaging.

Miles Smith

Arizona State University to host third CHIPS facility for semiconductor R&D

The facility, the third in the CHIPS for America program, is expected to be operational by 2028.

Keaton Peters

$300 million investment to jumpstart three US semiconductor packaging operations

The funding looks to accelerate development of advanced semiconductor technology that is critical for artificial intelligence and next-generation computing.

Brady Pieper

Silicon Valley to host CHIPS for America flagship facility

The location was chosen for its ample availability of world-leading research facilities, higher education institutions and global talent.

Miles Smith

Albany lands flagship $825 million federal semiconductor tech center

EUV technology is essential to the semiconductor industry and some of the most advanced machinery in the world, in which light is used to print patterns and make chips on wafers.

Brady Pieper

Department of Commerce unveils $1.6B notice of funding opportunity to advance semiconductor packaging

This funding is designed to help the U.S. semiconductor industry adopt innovative packing flows, crucial for integrating multiple components into single electronic devices.

Pete Hahnloser

Commerce seeking partners for three facilities to advance semiconductor research

Cutting-edge facilities are positioned to become premier domestic destinations for advanced semiconductor R&D

Pete Hahnloser

Additional $1.6 billion to help U.S. regain chip leadership

Funds will support research and development activities that will help establish and accelerate domestic capacity for advanced semiconductor packaging

Miles Smith

Feds to spend $5 billion on semiconductor research, production

Plan includes investing hundreds of millions to create a workforce center that will have a presence in several U.S. regions

Miles Smith

$3 billion advanced packaging program aims to advance U.S. semiconductor sector

Funds seek to drive leadership in advanced packaging technology through the new National Advanced Packaging Program, a part of the Department of Commerce’s CHIPS for America program

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