Silicon Valley to host CHIPS for America flagship facility
The location was chosen for its ample availability of world-leading research facilities, higher education institutions and global talent.
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With better data and AI, New York City plans to speed up transportation projects
The plan will transform how the city conducts transportation analysis, a process that currently adds substantial time and cost to development projects
University of Cincinnati projects using AI, ‘smart’ hard hats to improve worker safety
Researchers are using generative AI to predict worker movements in order to avoid collisions with robots, and developing "smart" hard hats that can detect potential concussions.
Tennessee investing over $100 million to bridge digital divide, expand broadband service
The funding will help the state's goal of connecting all Tennesseans to reliable, high-speed internet by 2028.
DoD publishes final rule that establishes contractor requirements
The program creates a unified system of requirements for contractors to manage unclassified information that need protection or dissemination controls.
Albany lands flagship $825 million federal semiconductor tech center
EUV technology is essential to the semiconductor industry and some of the most advanced machinery in the world, in which light is used to print patterns and make chips on wafers.
Virginia assembles artificial intelligence task force
The task force is made up of 10 of Virginia's most prominent AI experts from universities, non-profits and private corporations.
Feds approve California’s application for $70 million in grants to bridge digital divide
This funding will be used to connect thousands of Californians to high speed internet service.
To meet AI energy needs, big tech chooses the nuclear option
The investments by Google, Amazon and Microsoft come alongside the rapid development of artificial intelligence that has dramatically increased tech companies' energy demands.
Department of Commerce unveils $1.6B notice of funding opportunity to advance semiconductor packaging
This funding is designed to help the U.S. semiconductor industry adopt innovative packing flows, crucial for integrating multiple components into single electronic devices.
