U.S. Department of Commerce Archives

$1.4 billion awarded for domestic semiconductor packaging research, development

The federal funding is part of the CHIPS for America agenda and looks to establish domestic capacity for advanced semiconductor packaging.

Brady Pieper

Feds invest $210 million in regional tech hubs to drive innovation, strengthen national security

The funding will develop six new technology hubs that reinforce American economic competitiveness and national security.

Brady Pieper

NTIA opens $450 million funding opportunity for nationwide wireless network innovation

This NOFO will pursue applicants developing software solutions that accelerate the adoption of open and interoperable wireless networks.

Miles Smith

New York issues RFA for $664 million to expand broadband internet access

The ConnectALL Deployment Program seeks to expand low-cost, reliable, high-speed internet to businesses and homes in areas without dependable broadband options.

Keaton Peters

$300 million investment to jumpstart three US semiconductor packaging operations

The funding looks to accelerate development of advanced semiconductor technology that is critical for artificial intelligence and next-generation computing.

Pete Hahnloser

$285 million designated for North Carolina semiconductor institute

The SMART USA facility will focus on using so-called “digital twins” to enhance semiconductor design, manufacturing, advanced packaging, assembly and testing in the U.S.

Brady Pieper

Silicon Valley to host CHIPS for America flagship facility

The location was chosen for its ample availability of world-leading research facilities, higher education institutions and global talent.

Brady Pieper

Feds approve California’s application for $70 million in grants to bridge digital divide

This funding will be used to connect thousands of Californians to high speed internet service.

Brady Pieper

Department of Commerce unveils $1.6B notice of funding opportunity to advance semiconductor packaging

This funding is designed to help the U.S. semiconductor industry adopt innovative packing flows, crucial for integrating multiple components into single electronic devices.

Adam Rollins

DOC to open $100 million competition to develop semiconductor AI technologies

The Notice of Funding Opportunity will support efforts to secure the long-term efficacy and viability of domestic semiconductor manufacturing.

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U.S. Department of Commerce